SBOA446 March 2021 TLV9002-Q1 , TLV9004-Q1
This section provides a Failure Mode Analysis (FMA) for the pins of the TLV9002-Q1 (SOIC (8) and VSSOP (8) packages) and TLV9004-Q1 (SOIC (14) and SOT-23 (14) package). The failure modes covered in this document include the typical pin-by-pin failure scenarios:
Table 4-2 through Table 4-9 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.
| Class | Failure Effects |
|---|---|
| A | Potential device damage that affects functionality |
| B | No device damage, but loss of functionality |
| C | No device damage, but performance degradation |
| D | No device damage, no impact to functionality or performance |