ZHCSPX8B january 2000 – june 2023 XTR115 , XTR116
PRODUCTION DATA
| THERMAL METRIC(1) | XTR11x | UNIT | |
|---|---|---|---|
| D (SOIC) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 128.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 68.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 75.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 15.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 74.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |