ZHCSGC2I June 2017 – March 2024 UCC5310 , UCC5320 , UCC5350 , UCC5390
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Device Comparison Table
- 5 Pin Configuration and Function
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Power Ratings
- 6.6 Insulation Specifications for D Package
- 6.7 Insulation Specifications for DWV Package
- 6.8 Safety-Related Certifications For D Package
- 6.9 Safety-Related Certifications For DWV Package
- 6.10 Safety Limiting Values
- 6.11 Electrical Characteristics
- 6.12 Switching Characteristics
- 6.13 Insulation Characteristics Curves
- 6.14 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Revision History
- 14Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
12.7 靜電放電警告
 |
靜電放電 (ESD) 會損壞這個集成電路。德州儀器 (TI) 建議通過適當?shù)念A防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會損壞集成電路。 |
| ESD 的損壞小至導致微小的性能降級，大至整個器件故障。精密的集成電路可能更容易受到損壞，這是因為非常細微的參數(shù)更改都可能會導致器件與其發(fā)布的規(guī)格不相符。 |