ZHCSDP7C May 2015 – July 2024 UCC27201A-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | UCC27201A-Q1 | UNIT | |
|---|---|---|---|
| DDA (PowerPad? SOIC) | |||
| 8 Pins | |||
| RθJA | Junction-to-ambient thermal resistance | 44.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 68.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 20 | °C/W |
| ψJT | Junction-to-top characterization parameter | 6.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 20 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 8.4 | °C/W |