ZHCSB24F May 2013 – August 2018 TS3DV642
PRODUCTION DATA.
| THERMAL METRIC(1) | TS3DV642 | UNIT | |
|---|---|---|---|
| RUA | |||
| 42 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 31.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 16.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 5.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 5.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.0 | °C/W |