ZHCSLP5E June 2007 – December 2024 TRS3232E
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 ESD Ratings - IEC Specifications
- 5.4 Recommended Operating Conditions
- 5.5 Thermal Information
- 5.6 Electrical Characteristics — Device
- 5.7 Electrical Characteristics — Driver
- 5.8 Electrical Characteristics — Receiver
- 5.9 Switching Characteristics
- Typical Characteristics
- 6 Parameter Measurement Information
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
4 Pin Configuration and Functions
Figure 4-1 DB, PW or DYY Package16-Pin SSOP, TSSOP, or SOT-23-THN
(Top View)
Figure 4-2 RGT package, 16 Pin VQFN, Top ViewTable 4-1 Pin Functions
| PIN | TYPE | DESCRIPTION | ||
|---|---|---|---|---|
| NAME | NO. | RGT | ||
| C1+ | 1 | 16 | — | Positive lead of C1 capacitor |
| C1– | 3 | 1 | — | Negative lead of C1 capacitor |
| C2+ | 4 | 2 | — | Positive lead of C2 capacitor |
| C2– | 5 | 3 | — | Negative lead of C2 capacitor |
| DIN1 | 11 | 9 | I | Logic data input (from UART) |
| DIN2 | 10 | 8 | I | Logic data input (from UART) |
| DOUT2 | 7 | 5 | O | RS232 line data output (to remote RS232 system) |
| DOUT1 | 14 | 12 | O | RS232 line data output (to remote RS232 system) |
| GND | 15 | 13 | — | Ground |
| RIN1 | 13 | 11 | I | RS232 line data input (from remote RS232 system) |
| RIN2 | 8 | 6 | I | RS232 line data input (from remote RS232 system) |
| ROUT2 | 9 | 7 | O | Logic data output (to UART) |
| ROUT1 | 12 | 10 | O | Logic data output (to UART) |
| V+ | 2 | 15 | O | Positive charge pump output for storage capacitor only |
| V– | 6 | 4 | O | Negative charge pump output for storage capacitor only |
| VCC | 16 | 14 | — | Supply voltage, connect to external 3-V to 5.5-V power supply |
| Thermal Pad | Yes | — | Thermal pad for improving heat dissipation. Can be connected to GND or left floating. | |