10 Revision History
Changes from Revision D (June 2021) to Revision E (December 2024)
- 將器件信息 表更改為封裝信息 表Go
- 向數(shù)據(jù)表中添加了 SOT-23-THN (DYY) 封裝Go
- Added Note 2 to the ESD ratings
- IEC Specifications
Go
Changes from Revision C (June 2021) to Revision D (June 2021)
- 添加了應用工業(yè) PC、有線網(wǎng)絡、數(shù)據(jù)中心和企業(yè)級計算Go
- Changed the table note in the ESD Ratings - IEC Specifications to make it
applicable to D, DB and PW packages. Go
- Changed the thermal parameter values for D, DB and PW packages in the Thermal Information tableGo
Changes from Revision B (October 2017) to Revision C (June 2021)
- 向器件信息 添加了 RGT 封裝Go
- Added the RGT Pin Configuration
Go
- Added the ESD Ratings - IEC Specifications
Go
- Added RGT to the Thermal Information
Go
- Added RGT package to the Switching
Characteristics
Go
- Changed the capacitor value From: 1 μf To: 0.1 μf in the Layout
Diagram
Go
Changes from Revision A (July 2015) to Revision B (October 2017)
- 添加了特性：可與低至 2.7V VCC 的 RS-232 交互操作Go
- Added Figure 5-3
Go
Changes from Revision * (April 2007) to Revision A (July 2015)
- 刪除了訂購信息 表Go
- 添加了器件信息 表、引腳配置和功能 部分、ESD 等級 表、熱性能信息 表、特性說明 部分、器件功能模式、應用和實施 部分、電源相關(guān)建議 部分、布局 部分、器件和文檔支持 部分以及機械、封裝和可訂購信息 部分Go