ZHCSOW9C october 2022 – july 2023 TPSM82912 , TPSM82913 , TPSM82913E
PRODUCTION DATA
| THERMAL METRIC(1) | TPSM8291x | UNIT | ||
|---|---|---|---|---|
| RDU 30-pin QFN | ||||
| JEDEC 51-7 PCB | TPSM8291xEVM-213 | |||
| RθJA | Junction-to-ambient thermal resistance | 31.3 | 30.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 22.4 | n/a (2) | °C/W |
| RθJB | Junction-to-board thermal resistance | 7.2 | n/a (2) | °C/W |
| ΨJT | Junction-to-top characterization parameter | -4.9 (3) | -3.0 (3) | °C/W |
| YJB | Junction-to-board characterization parameter | 7.1 | 9.0 | °C/W |