ZHCSMH9C april 2022 – august 2023 TPSI3052-Q1
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Revision History
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Power Ratings
- 6.6 Insulation Specifications
- 6.7 Safety-Related Certifications
- 6.8 Safety Limiting Values
- 6.9 Electrical Characteristics
- 6.10 Switching Characteristics
- 6.11 Insulation Characteristic Curves
- 6.12 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Detailed Description
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Application
- 9.2.1 Design Requirements
- 9.2.2
Detailed Design Procedure
- 9.2.2.1 Two-Wire or Three-Wire Mode Selection
- 9.2.2.2 Standard Enable, One-Shot Enable
- 9.2.2.3 CDIV1, CDIV2 Capacitance
- 9.2.2.4 RPXFR Selection
- 9.2.2.5 CVDDP Capacitance
- 9.2.2.6 Gate Driver Output Resistor
- 9.2.2.7 Start-up Time and Recovery Time
- 9.2.2.8 Supplying Auxiliary Current, IAUX From VDDM
- 9.2.2.9 VDDM Ripple Voltage
- 9.2.3 Application Curves
- 9.2.4 Insulation Lifetime
- 9.3 Power Supply Recommendations
- 9.4 Layout
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DWZ|8
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
5 Pin Configuration and Functions
Figure 5-1 TPSI3052-Q1, TPSI3052S-Q1
8-Pin SOIC
Top ViewTable 5-1 Pin Functions
| PIN | I/O | TYPE(1) | DESCRIPTION | |
|---|---|---|---|---|
| NO. | NAME | |||
| 1 | EN | I | — | Active high driver enable |
| 2 | PXFR | I | — | Power transfer can be adjusted by selecting one of seven power level settings using an external resistor from the PXFR pin to VSSP. In three-wire mode, a given resistor setting sets the duty cycle of the power converter (see Table 8-1) and hence the amount of power transferred. In two-wire mode, a given resistor setting adjusts the current limit of the EN pin (see Table 8-2) and hence the amount of power transferred. |
| 3 | VDDP | — | P | Power supply for primary side |
| 4 | VSSP | — | GND | Ground supply for primary side |
| 5 | VSSS | — | GND | Ground supply for secondary side |
| 6 | VDDM | — | P | Generated mid supply |
| 7 | VDDH | — | P | Generated high supply |
| 8 | VDRV | O | — | Active high driver output |
(1) P = power, GND = ground, NC = no connect