ZHCSSL6C July 2023 – April 2024 TPS7H6003-SP , TPS7H6013-SP , TPS7H6023-SP
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | TPS7H60x3-SP | UNIT | |
|---|---|---|---|
| CFP | |||
| 48 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 22.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 7.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 6.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 8.5 | °C/W |
| ΨθJT | Junction-to-top characterization parameter | 3.7 | °C/W |
| ΨθJB | Junction-to-board characterization parameter | 8.3 | °C/W |