ZHCSRP2B February 2023 – December 2023 TPS7H3302-SEP , TPS7H3302-SP
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
Figure 5-1 DAP
Package, 32-Pin HTSSOP (Top View)| PIN | I/O(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| VTTREF | 4 | O | Reference output. Connect to GND through 0.1-μF ceramic capacitor. |
| VDDQSNS | 5 | I | VDDQ sense input. Reference input for VTTREF.(2) |
| VLDOIN | 7 | I | Supply voltage for the LDO. Connect to VDDQ voltage or an alternate voltage source. |
| 8 | |||
| PGND | 9 | — | Power ground. Connect to system ground. |
| 10 | |||
| 11 | |||
| EN | 20 | I | Enable pin. Driving this pin to logic high enables the device; driving this pin to logic low disables the device. |
| VDD | 21 | I | 2.5- or 3.3-V power supply. A ceramic decoupling capacitor with a value between 1 and 10 μF is required. |
| PGOOD | 22 | O | PGOOD output pin. PGOOD pin is an open drain output to indicate the output voltage is within specification. |
| VTT | 23 | O | Power output for VTT LDO. |
| 24 | |||
| 25 | |||
| 26 | |||
| AGND | 28 | — | Signal ground. Connect to system ground. |
| VTTSNS | 29 | I | Voltage sense for VTT. Place capacitor close to pin. Route sense line to VTT near load. |
| NC | 1-3, 6, 12-19, 27, 30-32 | — | No connect. These pins are not internally connected. It is recommended to connect these pins to ground to prevent charge buildup; however, these pins can also be left open or tied to any voltage between ground and VDD. |
| Thermal Pad | — | Connect to PGND. This is internally floating. | |