ZHCSOS3F August 2021 – March 2024 TPS7H2211-SEP , TPS7H2211-SP
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | TPS7H2211-SP | TPS7H2211-SEP | UNIT | |
|---|---|---|---|---|
| HKR (CFP) | DAP (HTSSOP) | |||
| 16 PINS | 32 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 23 | 23.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 5.4 | 11.2 | |
| RθJB | Junction-to-board thermal resistance | 7.7 | 5.4 | |
| ψθJT | Junction-to-top characterization parameter | 1.3 | 0.1 | |
| ψθJB | Junction-to-board characterization parameter | 7.4 | 5.4 | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 0.33 | 0.5 | |