ZHCSOS3F August 2021 – March 2024 TPS7H2211-SEP , TPS7H2211-SP
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Device Options
- 5 Related Products
- 6 Pin Configuration and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Electrical Characteristics: All Devices
- 7.6 Electrical Characteristics: CFP and KGD Options
- 7.7 Electrical Characteristics: HTSSOP Option
- 7.8 Switching Characteristics: All Devices
- 7.9 Quality Conformance Inspection
- 7.10 Typical Characteristics
- 8 Parameter Measurement Information
- 9 Detailed Description
- 10Application and Implementation
- 11Device and Documentation Support
- 12Revision History
- 13Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DAP|32
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DAP|32
訂購(gòu)信息
10.2.1.3 Application Curve
Figure 10-3 shows the first eFuse being enabled. Figure 10-4 shows the first eFuse being powered down and the second device being powered up (switch from primary to secondary power). The less time both switches are turned-off, the less droop on VOUT.
Figure 10-3 Power-Up
Behavior of Primary TPS7H2211 in a Cold Sparing Application
Figure 10-4 Switch
From
Primary to Secondary TPS7H2211 in a Cold Sparing
Application