ZHCSU17F March 2009 – April 2024 TPS798-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | TPS798-Q1 | UNIT | |
|---|---|---|---|
| DGN (HVSSOP) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance (JEDEC 51-5(2)) | 57.1 | °C/W |
| Junction-to-ambient thermal resistance (JEDEC 51-7(3)) | 130 | °C/W | |
| RθJC(top) | Junction-to-case (top) thermal resistance | 50.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 30.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 30.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 6.5 | °C/W |