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ZHCSBF7C August 2013 – May 2015 TPS65279

PRODUCTION DATA.

封裝選項(xiàng)

機(jī)械數(shù)據(jù) (封裝 | 引腳)

DAP|32
- MPDS380A
RHH|36
- MPQF144E

散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)

DAP|32
- PPTD257B
RHH|36
- QFND054L

訂購信息

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

		MIN	MAX	UNIT
	Voltage at VIN, PVIN1, PVIN2	–0.3	20	V
	Voltage at LX1, LX2 (maximum withstand voltage transient < 20 ns)	–4.5	23	V
	Voltage at BST1, BST2, referenced to LX1, LX2 pin	–0.3	7	V
	Voltage at V7V, EN1, EN2, RLIM1, RLIM2, PGOOD1, PGOOD2, MODE, ISHARE, ROSC	–0.3	7	V
	Voltage at SS1, SS2, FB1, FB2, COMP1, COMP2	–0.3	3.6	V
	Voltage at AGND, PGND1, PGND2	–0.3	0.3	V
T_J	Operating virtual junction temperature	–40	150	°C
T_stg	Storage temperature	–55	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

				VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM)		2000	V
V_(ESD)	Electrostatic discharge	Charge device model (CDM)		1000	V

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

		MIN	MAX	UNIT
V_IN	Supply input voltage range	4.5	18	V
I_OUT1, I_OUT2	Load current	0	5	A
V_out	Output voltage	0.6	9	V
EN	Enable voltage	0	6	V
T_J	Operating junction temperature	–40	125	°C

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		TPS65279		UNIT
		DAP (HTSSOP)	RHH (VQFN)
		32 PINS	36 PINS
R_θJA	Junction-to-ambient thermal resistance	35	30.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	17.7	18.8	°C/W
R_θJB	Junction-to-board thermal resistance	19	6	°C/W
ψ_JT	Junction-to-top characterization parameter	0.5	0.2	°C/W
ψ_JB	Junction-to-board characterization parameter	18.9	6	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	1.3	0.7	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

T_J = –40°C to 125°C, V_IN = 12 V (unless otherwise noted)

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
INPUT SUPPLY
V_IN	Input voltage range	VIN1 and VIN2	4.5		18	V
IDD_SDN	Shutdown supply current	EN1 = EN2 = low		10		µA
IDD_{Q_NSW}	Switching quiescent current with no load at DCDC output	EN1 = EN2 = 3.3 V With power skip mode, without bucks switching		1.2		mA
IDD_{Q_SW}	Switching quiescent current with no load at DCDC output, Buck switching	EN1 = EN2 = 3.3 V With bucks switching		10		mA
UVLO	V_IN undervoltage lockout	Rising V_IN		4.25	4.50	V
		Falling V_IN	3.4	3.75
		Hysteresis		0.5
V_7V	6.3 V LDO	V_7V load current = 0 A	6.10	6.3	6.5	V
I_{OCP_V7V}	Current limit of V7V LDO			200		mA
ENABLE
V_ENR	Enable threshold	Rising		1.21	1.3	V
V_ENF	Enable threshold	Falling	1.0	1.17		V
I_ENR	Enable Input current	EN = 1 V		3		µA
I_ENF	Enable hysteresis current	EN = 1.5 V		3		µA
OSCILLATOR
F_SW	Switching frequency		200		1600	kHz
F_SW	Switching frequency	R_OSC = 100 kΩ (1%)	340	400	460	kHz
t_{SYNC_w}	Clock sync minimum pulse width			20		ns
V_{SYNC_HI}	Clock sync high threshold				2	V
V_{SYNC_LO}	Clock sync low threshold		0.8			V
V_{SYNC_D}	Clock falling edge to LX rising edge delay			66		ns
F_SYNC	Clock sync frequency range		200		1600	kHz
BUCK 1, BUCK 2 CONVERTERS
V_ref(min)	Voltage reference	0 A < I_OUT1 < 6 A, 0 A < I_OUT2 < 3.5 A	0.594	0.6	0.606	V
V_LINEREG	Line regulation-DC	I_OUT = 2 A		0.5		%/V
V_LOADREG	Load regulation-DC	I_OUT = (10-90%) x I_{OUT_max}		0.5		%/A
G_{m_EA}	Error amplifier trans-conductance	-2 µA < I_COMP < 2 µA		1350		µS
G_{m_SRC}	COMP voltage to inductor current Gm	I_LX= 0.5 A		10		A/V
I_SSx	Soft-start pin charging current			6		µA
I_LIMIT1	Buck 1 peak inductor current limit	R_LIM1 = 60.4 kΩ		7.3		A
I_LIMIT2	Buck 2 peak inductor current limit	R_LIM2 = 60.4 kΩ		7.3		A
I_LIMITLSx	Low side sinking current limit			-2.6		A
R_{dsonx_HS}	On resistance of high side FET	V7V = 6.3 V		31		mΩ
R_{dsonx_LS}	On resistance of low side FET	V_IN = 12 V		23		mΩ
T_minon	Minimum on time			94		ns
V_bootUV	Boot-LX UVLO			2.1	3	V
T_hiccupwait	Hiccup wait time			512		cycles
T_{hiccup_re}	Hiccup time before re-start			16384		cycles
PGOOD
V_PGOOD	PGOOD trip levels	FB rising to PGOOD high		94%
		FB falling to PGOOD low		92.5%
		FB rising to PGOOD low		107.5%
		FB falliong to PGOOD high		105.5%
THERMAL SHUTDOWN
T_TRIP	Thermal protection trip point	Rising temperature		160		°C
T_HYST	Thermal protection hysteresis			20		°C