ZHCSCL5D january 2014 – may 2023 TPS65262
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Adjusting the Output Voltage
- 7.3.2 Enable and Adjusting Undervoltage Lockout
- 7.3.3 Soft-Start Time
- 7.3.4 Power-Up Sequencing
- 7.3.5 V7V Low Dropout Regulator and Bootstrap
- 7.3.6 Out-of-Phase Operation
- 7.3.7 Output Overvoltage Protection (OVP)
- 7.3.8 PSM
- 7.3.9 Slope Compensation
- 7.3.10 Overcurrent Protection
- 7.3.11 Power Good
- 7.3.12 Thermal Shutdown
- 7.4 Device Functional Modes
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
- RHB|32
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- RHB|32
訂購信息
5 Pin Configuration and Functions
(There is no electric signal down bonded to thermal pad inside IC. Exposed thermal pad must be soldered to PCB for optimal thermal performance.)
Figure 5-1 32-Pin Plastic VQFNRHB PackageTop ViewTable 5-1 Pin Functions
| PIN | DESCRIPTION | |
|---|---|---|
| NAME | NO. | |
| LVIN2 | 1 | Input power supply for LDO2. Connect LVIN2 pin as close as possible to the (+) terminal of an input ceramic capacitor (suggest 1 μF). |
| LOUT2 | 2 | LDO2 output. Connect LOUT2 pin as close as possible to the (+) terminal of an output ceramic capacitor (suggest 1 μF). |
| LFB2 | 3 | Feedback Kelvin sensing pin for LDO2 output voltage. Connect this pin to LDO2 resistor divider. |
| LEN2 | 4 | Enable for LDO2. Float to enable. |
| PGOOD | 5 | An open-drain output, asserts low if output voltage of any buck is beyond regulation range due to thermal shutdown, overcurrent, undervoltage, or ENx shut down. |
| MODE | 6 | When high, an automatic power-up/power-down sequence is provided according to states of EN1, EN2 and EN3 pins. |
| FB2 | 7 | Feedback Kelvin sensing pin for buck2 output voltage. Connect this pin to buck2 resistor divider. |
| EN2 | 8 | Enable for buck2. Float to enable. Can use this pin to adjust the input undervoltage lockout of buck2 with a resistor divider. |
| BST2 | 9 | Boot strapped supply to the high side floating gate driver in Buck2. Connect a capacitor (recommend 47 nF) from BST2 pin to LX2 pin. |
| LX2 | 10 | Switching node connection to the inductor and bootstrap capacitor for Buck2. The voltage swing at this pin is from a diode voltage below the ground up to VIN2 voltage. |
| PGND2 | 11 | Power ground connection of Buck2. Connect PGND2 pin as close as possible to the (–) terminal of VIN2 input ceramic capacitor. |
| VIN2 | 12 | Input power supply for Buck2. Connect VIN2 pin as close as possible to the (+) terminal of an input ceramic capacitor (suggest 10 μF). |
| VIN3 | 13 | Input power supply for Buck3. Connect VIN3 pin as close as possible to the (+) terminal of an input ceramic capacitor (suggest 10 μF). |
| PGND3 | 14 | Power ground connection of Buck3. Connect PGND3 pin as close as possible to the (–) terminal of VIN3 input ceramic capacitor. |
| LX3 | 15 | Switching node connection to the inductor and bootstrap capacitor for Buck3. The voltage swing at this pin is from a diode voltage below the ground up to VIN3 voltage. |
| BST3 | 16 | Boot strapped supply to the high side floating gate driver in Buck3. Connect a capacitor (recommend 47 nF) from BST3 pin to LX3 pin. |
| EN3 | 17 | Enable for Buck3. Float to enable. Can use this pin to adjust the input undervoltage lockout of Buck3 with a resistor divider. |
| FB3 | 18 | Feedback Kelvin sensing pin for buck3 output voltage. Connect this pin to Buck3 resistor divider. |
| AGND | 19 | Analog ground common to buck controllers and other analog circuits. It must be routed separately from high current power grounds to the (-) terminal of bypass capacitor of input voltage VIN. |
| V7V | 20 | Internal LDO for gate driver and internal controller. Connect a 10-μF capacitor from the pin to power ground |
| COMP1 | 21 | Error amplifier output and loop compensation pin for Buck1. Connect a series resistor and capacitor to compensate the control loop of buck1 with peak current PWM mode. |
| SS1 | 22 | Soft-start and tracking input for Buck1. An internal 5-μA pullup current source is connected to this pin. The soft-start time can be programmed by connecting a capacitor between this pin and ground. |
| FB1 | 23 | Feedback Kelvin sensing pin for Buck1 output voltage. Connect this pin to Buck1 resistor divider. |
| EN1 | 24 | Enable for Buck1. Float to enable. Can use this pin to adjust the input undervoltage lockout of Buck1 with a resistor divider. |
| BST1 | 25 | Boot strapped supply to the high side floating gate driver in buck1. Connect a capacitor (recommend 47 nF) from BST1 pin to LX1 pin. |
| LX1 | 26 | Switching node connection to the inductor and bootstrap capacitor for buck1. The voltage swing at this pin is from a diode voltage below the ground up to VIN1 voltage. |
| PGND1 | 27 | Power ground connection of buck1. Connect PGND1 pin as close as possible to the (–) terminal of VIN1 input ceramic capacitor. |
| VIN1 | 28 | Input power supply for buck1. Connect VIN1 pin as close as possible to the (+) terminal of an input ceramic capacitor (suggest 10 μF). |
| LEN1 | 29 | Enable for LDO1. Float to enable. |
| LFB1 | 30 | Feedback Kelvin sensing pin for LDO1 output voltage. Connect this pin to LDO1 resistor divider. |
| LOUT1 | 31 | LDO1 output. Connect LOUT1 pin as close as possible to the (+) terminal of an output ceramic capacitor (suggest 1 μF). |
| LVIN1 | 32 | Input power supply for LDO1. Connect LVIN1 pin as close as possible to the (+) terminal of an input ceramic capacitor (suggest 1 μF). |
| PAD | — | There is no electric signal down bonded to thermal pad inside IC. Exposed thermal pad must be soldered to PCB for optimal thermal performance. |