ZHCSJH9A August 2019 – August 2019 TPS56C230
PRODUCTION DATA.
| THERMAL METRIC(1) | TPS56C230 | UNIT | |
|---|---|---|---|
| RJE (VQFN) | |||
| 20 PINS | |||
| RθJA | Junction-to-ambient thermal resistance (standard board) | 42.3 | °C/W |
| RθJA_effective | Junction-to-ambient thermal resistance (4-layer custom board)(2) | 28.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 26.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 13 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 12.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 16.1 | °C/W |