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ZHCSCI5B May 2014 – July 2016 TPS544B20 , TPS544C20

PRODUCTION DATA.

封裝選項(xiàng)

機(jī)械數(shù)據(jù) (封裝 | 引腳)

RVF|40
- MPQF268C

散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)

RVF|40
- QFND333E

訂購信息

1 特性

啟用 PMBus 的轉(zhuǎn)換器：20A，30A
4.5V 至 18V 輸入，0.6V 至 5.5V 輸出
5mm x 7mm 薄型四方扁平無引線 (LQFN) 封裝，焊球間距為 0.5mm
單個散熱焊盤
集成 4.5mΩ 和 2.0mΩ 堆疊 NexFET™功率級
600mV，0.5% 基準(zhǔn)
無損耗、低側(cè)金屬氧化物半導(dǎo)體場效應(yīng)晶體管 (MOSFET) 電流感測
可選 D-CAP™和 D-CAP2™模式控制
差分遠(yuǎn)程感應(yīng)
單啟動至預(yù)偏置輸出
輸出電壓裕度和修整
輸出電壓和輸出電流報(bào)告
使用 2N3904 時(shí)的外部溫度監(jiān)視
可經(jīng)由 PMBus 編程
- 過流保護(hù)
- 欠壓閉鎖 (UVLO)，軟啟動
- 電源正常 (PGOOD)，過壓 (OV)，欠壓 (UV)，過熱 (OT) 電平
- 故障響應(yīng)
- 接通和關(guān)閉延遲
熱關(guān)斷
引腳兼容 20A，30A 轉(zhuǎn)換器

2 應(yīng)用范圍

測試和測量儀器
以太網(wǎng)交換機(jī)、光交換機(jī)、路由器、基站
服務(wù)器
企業(yè)級存儲固態(tài)硬盤 (SSD)
高密度電源解決方案

3 說明

TPS544B20 和 TPS544C20 器件是 PMBus 兼容型非隔離式直流/直流集成式 FET 轉(zhuǎn)換器，支持高頻運(yùn)行并提供 20A 或 30A 電流輸出，采用 5mm × 7mm 封裝，可實(shí)現(xiàn)高功率密度和快速瞬態(tài)性能，具有最小的 PCB 面積。PMBus 接口用于轉(zhuǎn)換器配置，并監(jiān)視關(guān)鍵參數(shù)，其中包括輸出電壓、電流和一個可選外部溫度。由集成 NexFET 功率級和經(jīng)優(yōu)化驅(qū)動器提供的高頻、低損耗開關(guān)可實(shí)現(xiàn)極高密度電源解決方案以及減小的電感器和濾波電容器尺寸。根據(jù)系統(tǒng)要求，對故障情況的響應(yīng)可被設(shè)定為重新啟動或鎖斷。

Table 1. 器件信息⁽¹⁾

部件名稱	封裝	封裝尺寸（標(biāo)稱值）
TPS544B20	LQFN (40)	5.00mm x 7.00mm
TPS544C20	LQFN (40)	5.00mm x 7.00mm

如需了解所有可用封裝，請見數(shù)據(jù)表末尾的可訂購產(chǎn)品附錄。

效率與輸出電流間的關(guān)系

TPS544B20 TPS544C20 Efficiency_12vin_fp.png

4 修訂歷史記錄

Changes from A Revision (February 2016) to B Revision

Changed From: PGND to GND in the Pin Functions table Description for pins BP6 and BPEXT.Go
Changed Pin Functions table Description for VDD pin To: "Bypass with a 0.1-µF to 1.0-µF capacitor to GND (thermal pad or GND pins) or through a dedicated connection to AGNDSNS." Go
Changed From: "PGND" To: "GND" in Linear Regulators BP3 and BP6 and External Bypass (BPEXT) Section text. Go
Changed instances From: "PGND" To: "GND" in the Device Functional ModesGo
Changed From: " a value of 4.7 μF" To: " a value of 0.1 μF to 1.0 μF" in the Input Capacitor SelectionGo
Changed text string From: "...one 4.7-μF, 25-V ceramic capacitor..." To: "...one 1.0-μF, 25-V ceramic capacitor..." in the Input Capacitor Selection description.Go
Changed From: "PGND" To: "GND" in the BP6, BP3 and BPEXT section Go
Added text to Layout Guidelines section for emphasis on grounding schemes. Go
Changed PCB Layout Recommendation figure. Go
Added 接收文檔更新通知 部分Go

Changes from * Revision (May 2014) to A Revision

Deleted package suffix and reel quantities from Device Comparison Table Go
Changed "Handling" Ratings table to "ESD" Ratings and moved T_stg spec to the Absolute Maximum Ratings table.Go
Added sentence in Switching Frequency description.Go
Changed "Hiccup" to "Shutdown and latch-off" as the Default Behavior for CMD Command; and, changed Default Register Value from 3Fh to 07h in Table 5, CMD Code 47h Go
Changed "address" to "frequency" in the PMBus Command Description for CMD Code 80h in Table 5. Go
Changed Default Value for Bit Position 5, 4, and 3 from 1 1 1 to 0 0 0 respectively in the IOUT_OC_FAULT_RESPONSE (47h) table. Go
Changed "IVADDR" to "IVFREQ" for Function at Bit Position 4 of the STATUS_MFR_SPECIFIC (80h); and also in the accompanying description. Go
Added 社區(qū)資源 部分Go