ZHCSTM4A October 2023 – March 2024 TPS25751
PRODUCTION DATA
| THERMAL METRIC(1) | TPS25751D | UNIT | |
|---|---|---|---|
| QFN | |||
| 38 PINS | |||
| RθJA | Junction-to-ambient thermal resistance (sinking through PP_HV) | 57.4 | °C/W |
| Junction-to-ambient thermal resistance (sourcing through PP_5V) | 46.5 | °C/W | |
| RθJC (top) | Junction-to-case (top) thermal resistance (sinking through PP_HV) | 30.5 | °C/W |
| Junction-to-case (top) thermal resistance (sourcing through PP_5V) | 20.3 | °C/W | |
| RθJB | Junction-to-board thermal resistance (sinking through PP_HV) | 21.1 | °C/W |
| Junction-to-board thermal resistance (sourcing through PP_5V) | 11.1 | °C/W | |
| ψJT | Junction-to-top characterization parameter (sinking through PP_HV) | 18.2 | °C/W |
| Junction-to-top characterization parameter (sourcing through PP_5V) | 1.0 | °C/W | |
| ψJB | Junction-to-board characterization parameter (sinking through PP_HV) | 21.1 | °C/W |
| Junction-to-board characterization parameter (sourcing through PP_5V) | 11.1 | °C/W | |
| RθJC (bot_GND) | Junction-to-case (bottom GND pad) thermal resistance | 1.8 | °C/W |
| RθJC (bot_DRAIN) | Junction-to-case (bottom DRAIN pad) thermal resistance | 4.6 | °C/W |