SLVSHZ1A June 2024 – July 2025 TPS1HTC100-Q1
PRODUCTION DATA
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Pin Configuration and Functions
- 5 Specifications
- 6 Parameter Measurement Information
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機械數(shù)據(jù) (封裝 | 引腳)
- PWP|14
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- PWP|14
訂購信息
4 Pin Configuration and Functions
Figure 4-1 PWP Package, 14-Pin HTSSOP (Top View)Table 4-1 Pin Functions
| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NO. | NAME | ||
| 1 | GND | Power | Ground of device. Connect to resistor- diode ground network to have reverse battery protection. |
| 2 | EN | I | Input control for channel activation, internal pulldown. |
| 3 | DIAG_EN | I | Enable-disable pin for diagnostics, internal pulldown. |
| 4 | FAULT | O | Open drain global fault output. Referred to FLT, or fault pin. |
| 5 | LATCH | I | Thermal shutdown behavior, latch off or auto retry, internal pull down. |
| 6 | SNS | O | Output corresponding sense value based on sense ratio. |
| 7 | ILIM | O | Adjustable current limit. Short to ground or leave floating if external current limit is not used. |
| 11 | NC | N/A | No internal connection. |
| 8, 9, 10 | VOUT | Power | Output of high side switch, connected to load. |
| 12, 13, 14 | VS | Power | Power supply. |
| Thermal Pad | Pad | — | Thermal pad, internally shorted to ground. |
(1) I = input, O = output, N/A = not applicable