ZHCSEZ9C January 2016 – August 2020 TPD3S714-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | TPD3S714-Q1 | UNIT | |
|---|---|---|---|
| DBQ (SSOP) | |||
| 16 PINS | |||
| θJA | Junction-to-ambient thermal resistance | 98.8 | °C/W |
| θJCtop | Junction-to-case (top) thermal resistance | 48 | °C/W |
| θJB | Junction-to-board thermal resistance | 41.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 8.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 41.2 | °C/W |
| θJCbot | Junction-to-case (bottom) thermal resistance | N/A | °C/W |