ZHCSNF7G February 2021 – July 2024 TMUX7234
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Thermal Information
- 5.4 Recommended Operating Conditions
- 5.5 Source or Drain Continuous Current
- 5.6 ±15 V Dual Supply: Electrical Characteristics?
- 5.7 ±15 V Dual Supply: Switching Characteristics?
- 5.8 ±20 V Dual Supply: Electrical Characteristics
- 5.9 ±20 V Dual Supply: Switching Characteristics
- 5.10 44 V Single Supply: Electrical Characteristics?
- 5.11 44 V Single Supply: Switching Characteristics?
- 5.12 12 V Single Supply: Electrical Characteristics?
- 5.13 12 V Single Supply: Switching Characteristics?
- 5.14 Typical Characteristics
-
6 Parameter Measurement Information
- 6.1 On-Resistance
- 6.2 Off-Leakage Current
- 6.3 On-Leakage Current
- 6.4 Transition Time
- 6.5 tON(EN) and tOFF(EN)
- 6.6 Break-Before-Make
- 6.7 tON (VDD) Time
- 6.8 Propagation Delay
- 6.9 Charge Injection
- 6.10 Off Isolation
- 6.11 Crosstalk
- 6.12 Bandwidth
- 6.13 THD + Noise
- 6.14 Power Supply Rejection Ratio (PSRR)
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Revision History
- 13Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
4 Pin Configuration and Functions
Figure 4-1
TMUX7234 PW Package, 20-Pin TSSOP (Top
View)
Figure 4-2
TMUX7234 RRQ Package, 20-Pin WQFN (Top
View)Table 4-1 Pin Functions TMUX7234
| PIN | TYPE(1) | DESCRIPTION(2) | ||
|---|---|---|---|---|
| NAME | PW NO. | RRQ NO. | ||
| SEL1 | 1 | 19 | I | Logic control input 1; has internal pull-down resistor. Controls switch 1 (see Section 7.5). |
| S1A | 2 | 20 | I/O | Source pin 1A. Can be an input or output. |
| D1 | 3 | 1 | I/O | Drain pin 1. Can be an input or output. |
| S1B | 4 | 2 | I/O | Source pin 1B. Can be an input or output. |
| VSS | 5 | 3 | P | Negative power supply. This pin has the most negative power-supply potential. This pin can be connected to ground in single supply applications. Connect a decoupling capacitor ranging from 0.1 μF to 10 μF between VSS and GND for reliable operation. |
| GND | 6 | 4 | P | Ground (0 V) reference. |
| S2B | 7 | 5 | I/O | Source pin 2B. Can be an input or output. |
| D2 | 8 | 6 | I/O | Drain pin 2. Can be an input or output. |
| S2A | 9 | 7 | I/O | Source pin 2A. Can be an input or output. |
| SEL2 | 10 | 8 | I | Logic control input 2; has internal pull-down resistor. Controls switch 2 (see Section 7.5). |
| SEL3 | 11 | 9 | I | Logic control input 3; has internal pull-down resistor. Controls switch 3 (see Section 7.5). |
| S3A | 12 | 10 | I/O | Source pin 3A. Can be an input or output. |
| D3 | 13 | 11 | I/O | Drain pin 3. Can be an input or output. |
| S3B | 14 | 12 | I/O | Source pin 3B. Can be an input or output. |
| EN | 15 | 18 | I | Active low logic enable; has internal pull-down resistor. The SELx logic inputs determine switch connections when this pin is low (see Section 7.5). |
| VDD | 16 | 13 | P | Positive power supply. This pin has the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 μF to 10 μF between VDD and GND. |
| S4B | 17 | 14 | I/O | Source pin 4B. Can be an input or output. |
| D4 | 18 | 15 | I/O | Drain pin 4. Can be input or output |
| S4A | 19 | 16 | I/O | Source pin 4A. Can be an input or output. |
| SEL4 | 20 | 17 | I | Logic control input 4, has internal pull-down resistor. Controls switch 4 (see Section 7.5). |
| Thermal Pad | — | The thermal pad is not connected internally. There is no requirement to solder this pad. If connected, it is recommended to leave the pad floating or tied to GND. | ||
(1) I = input, O = output, I/O = input and output, P = power.
(2) Refer to Section 7.4
for what to do with unused pins.