ZHCSJ53A December 2018 – February 2024 TMUX1109
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Thermal Information
- 5.5 Electrical Characteristics (VDD = 5V ±10 %)
- 5.6 Electrical Characteristics (VDD = 3.3V ±10 %)
- 5.7 Electrical Characteristics (VDD = 2.5V ±10 %), (VSS?= –2.5V ±10 %)
- 5.8 Electrical Characteristics (VDD = 1.8V ±10 %)
- 5.9 Electrical Characteristics (VDD = 1.2V ±10 %)
- Typical Characteristics
- 6 Detailed Description
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- PW|16
- RSV|16
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RSV|16
訂購信息
7.2.3 Application Curve
Charge injection impacts system performance and settling characteristics of the charge bucket circuit. A multiplexer with low charge injection and a flat response across input voltage allows the system to settle to the required precision during the ADC acquisition period. Figure 7-2 shows the flat charge injection of the TMUX1109 at multiple supply voltages.
| TA = 25°C |