ZHCSJX8J August 2018 – May 2021 TLV803E , TLV809E , TLV810E
PRODMIX
| THERMAL METRIC(1) | TLV803E, TLV809E, TLV810E | UNIT | |||
|---|---|---|---|---|---|
| DPW (X2SON) | DCK (SC70-3) | DBZ (SOT23-3) | |||
| 5 PINS | 3 PINS | 3 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 457.1 | 300.5 | 254.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 201.6 | 178.2 | 150.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 320.4 | 166.5 | 140.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 22.8 | 70 | 48.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 318.8 | 165.2 | 139.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |