ZHCSHH2B January 2018 – October 2018 TLV6710
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV6710 | UNITS | |
|---|---|---|---|
| DDC (SOT) | |||
| 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 201.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 47.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 51.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 50.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |