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ZHCSKJ6 December 2019 TL16C750E

PRODUCTION DATA.

封裝選項(xiàng)

機(jī)械數(shù)據(jù) (封裝 | 引腳)

PFB|48
- MTQF019B

散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)

訂購(gòu)信息

Table 4. Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER		TEST CONDITIONS		MIN	TYP	MAX	UNIT
V_CC = 1.8 V
V_OH	High-level output voltage	I_OH = –0.5 mA		1.3			V
V_OL	Low-level output voltage	I_OL = 1 mA				0.5	V
I_I	Input current	V_CC = 1.98 V, V_I = 0 to 1.98 V	V_SS = 0, All other terminals floating			10	μA
I_OZ	High-impedance state output current	V_CC = 1.98 V, V_O = 0 to 1.98 V	Chip selected in write mode or chip deselect			±20	μA
I_CC	Supply current	V_CC = 1.98 V, DSR, CTS, and RI at 2 V	All other inputs at 0.4 V, No load on outputs, XTAL1 at 16 MHz, Baud rate = 1 Mb/s			6	mA
C_I(CLK)	Clock input capacitance	V_CC = 0, f = 1 MHz, All other terminals grounded	V_SS = 0, T_A = 25°C,		5	7	pF
C_O(CLK)	Clock output capacitance				5	7
C_I	Input capacitance				6	10
C_O	Output capacitance				10	15
V_CC = 2.5 V
V_OH	High-level output voltage	I_OH = –1 mA		1.8			V
V_OL	Low-level output voltage	I_OL = 2 mA				0.5	V
I_I	Input current	V_CC = 2.75 V, V_I = 0 to 2.75 V	V_SS = 0, All other terminals floating			10	μA
I_OZ	High-impedance state output current	V_CC = 2.75 V, V_O = 0 to 2.75 V	Chip selected in write mode or chip deselect			±20	μA
I_CC	Supply current	V_CC = 2.75 V, DCD, CTS, and RI at 2 V	All other inputs at 0.6 V, No load on outputs, XTAL1 at 24 MHz, Baud rate = 1.5 Mb/s			13	mA
C_I(CLK)	Clock input capacitance	V_CC = 0, f = 1 MHz, All other terminals grounded	V_SS = 0, T_A = 25°C,		5	7	pF
C_O(CLK)	Clock output capacitance				5	7
C_I	Input capacitance				6	10
C_O	Output capacitance				10	15
V_CC = 3.3 V
V_OH	High-level output voltage	I_OH = –1.8 mA		2.4			V
V_OL	Low-level output voltage	I_OL = 3.2 mA				0.5	V
I_I	Input current	V_CC = 3.6 V, V_I = 0 to 3.6 V	V_SS = 0, All other terminals floating			10	μA
I_OZ	High-impedance state output current	V_CC = 3.6 V, V_O = 0 to 3.6 V	Chip selected in write mode or chip deselect			±20	μA
I_CC	Supply current	V_CC = 3.6 V, DSR, CTS, and RI at 2 V	All other inputs at 0.8 V, No load on outputs, XTAL1 at 32 MHz, Baud rate = 2 Mb/s			25	mA
C_I(CLK)	Clock input capacitance	V_CC = 0, f = 1 MHz, All other terminals grounded	V_SS = 0, T_A = 25°C,		5	7	pF
C_O(CLK)	Clock output capacitance				5	7
C_I	Input capacitance				6	10
C_O	Output capacitance				10	15
V_CC = 5 V
V_OH	High-level output voltage	I_OH = –4 mA		4			V
V_OL	Low-level output voltage	I_OL = 4 mA				0.5	V
I_I	Input current	V_CC = 5.5 V, V_I = 0 to 5.5 V	V_SS = 0, All other terminals floating			10	μA
I_OZ	High-impedance state output current	V_CC = 5.5 V, V_O = 0 to 5.5 V	Chip selected in write mode or chip deselect			±20	μA
I_CC	Supply current	V_CC = 5.5 V, DSR, CTS, and RI at 2 V	All other inputs at 0.8 V, No load on outputs, XTAL1 at 48 MHz, Baud rate = 3 Mb/s			60	mA
C_I(CLK)	Clock input capacitance	V_CC = 0, f = 1 MHz, All other terminals grounded	V_SS = 0, T_A = 25°C,		5	7	pF
C_O(CLK)	Clock output capacitance				5	7
C_I	Input capacitance				6	10
C_O	Output capacitance				10	15