ZHCSEZ1F April 2016 – June 2024 THS6212
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | THS6212 | UNIT | |
|---|---|---|---|
| RHF (VQFN) | |||
| 24 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 42.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 32.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 20.9 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 3.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 20.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 9.5 | °C/W |