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SCPS164D MAY 2007 – February 2017 TCA6507

PRODUCTION DATA.

封裝選項(xiàng)

機(jī)械數(shù)據(jù) (封裝 | 引腳)

RUE|12
- MPQF214B
PW|14
- MPDS360A

散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)

RUE|12
- QFND506

訂購信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

				MIN	MAX	UNIT
V_CC	Supply voltage			–0.5	4.6	V
V_I	Input voltage⁽²⁾			–0.5	6.5	V
V_O	Output voltage⁽²⁾				6.5	V
I_IK	Input clamp current	V_I < 0	SCL, EN		±20	mA
I_OK	Output clamp current	V_O < 0 or V_O > V_CC	P port, SDA		±20	mA
I_OL	Continuous output low current	V_O = 0 to V_CC	P port		50	mA
I_OL	Continuous output low current	V_O = 0 to V_CC	SDA		25	mA
I_CC	Continuous current through GND				250	mA
I_CC	Continuous current through V_CC				20	mA
T_stg	Storage temperature			–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±2000	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±1000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

				MIN	MAX	UNIT
V_CC	Supply voltage of I²C registers, oscillator, and control logic			1.65	3.6	V
V_IH	High-level input voltage	SCL, SDA, EN	1.65 V ≤ V_CC ≤ 1.95 V	1.3	3.6	V
V_IH	High-level input voltage	SCL, SDA, EN	1.96 V ≤ V_CC ≤ 3.6 V	0.7 × V_C_C	3.6	V
V_IL	Low-level input voltage	SCL, SDA, EN	1.65 V ≤ V_CC ≤ 1.95 V	–0.5	0.3	V
V_IL	Low-level input voltage	SCL, SDA, EN	1.96 V ≤ V_CC ≤ 3.6 V	–0.5	0.3 × V_CC	V
V_O	Output voltage			0	5.5	V
I_OL	Low-level output current ⁽¹⁾				40	mA
T_A	Operating free-air temperature			–40	85	°C

(1) The total current sourced by the P port must be limited to 200 mA.

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TCA6507			UNIT
		PW (TSSOP)	ZXU (BGA MICROSTAR JUNIOR)	RUE (X2QFN)
		14 PINS	12 PINS	12 PINS
R_θJA	Junction-to-ambient thermal resistance	127.2	155.2	181	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	55.8	99.4	80.4	°C/W
R_θJB	Junction-to-board thermal resistance	38.9	91.5	95.3	°C/W
ψ_JT	Junction-to-top characterization parameter	9.3	6.8	3.5	°C/W
ψ_JB	Junction-to-board characterization parameter	68.3	92.1	95.3	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

GND = 0 V, T_A = –40°C to +85°C

PARAMETER		TEST CONDITIONS	V_CC	MIN	TYP⁽¹⁾	MAX	UNIT
f_INT	Intensity control clock frequency	Operating mode	1.65 V to 3.6 V	28	32	58	kHz
V_IK	Input diode clamp voltage	I_I = –18 mA	1.65 V to 3.6 V	–1.2			V
V_POR	Power-on reset voltage	V_I = V_CC or GND, I_O = 0	1.65 V to 3.6 V		1.1	1.4	V
V_OL	SDA	I_OL = 6 mA	1.65 V to 3.6 V		0.2	0.6	V
I_OL	SDA		1.65 V to 3.6 V	3	13.2		mA
	P port⁽²⁾	V_OL = 0.5 V	1.65 V	25	59.7		mA
	P port⁽²⁾	V_OL = 0.6 V	1.8 V to 3.6 V	40	68		mA
I_I	SCL, SDA, EN	V_I = V_CC or GND, V_CC ≥ 1.65 V	1.65 V to 3.6 V			±0.1	μA
I_CC	Standby current	EN disabled, P port idle, Intensity control disabled, SCL = V_CC, SDA = V_CC, I_O = 0, f_SCL = 0	1.65 V to 1.95 V		2	12	μA
	Standby current		1.96 V to 3.6 V		3	15	μA
	Operating mode	P port running, Intensity control enabled, SCL = V_CC, SDA = V_CC, I_O = 0, f_SCL = 0	1.65 V to 1.95 V		9.7	17	μA
			1.96 V to 3.6 V		10.4	20
		P port running, Intensity control enabled, SDA = V_CC, I_O = 0, f_SCL = 400 kHz, t_r = 300 ns	1.65 V to 1.95 V		10.2	18
			1.96 V to 3.6 V		11.4	40
C_i	SCL		1.65 V to 3.6 V		7	10	pF
C_io	SDA	V_IO = V_CC or GND	1.65 V to 3.6 V		8	11	pF
C_o	P port	V_O = V_CC or GND	1.65 V to 3.6 V		7	10	pF

(1) All typical values are at T_A = 25°C.

(2) The total current sourced by the P port must be limited to 200 mA.

6.6 I²C Interface Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 8)

			MIN	MAX	UNIT
STANDARD MODE
f_scl	I²C clock frequency		0	100	kHz
t_sch	I²C clock high time		4		μs
t_scl	I²C clock low time		4.7		μs
t_sp	I²C spike time			50	ns
t_sds	I²C serial-data setup time		250		ns
t_sdh	I²C serial-data hold time		0		ns
t_icr	I²C input rise time			1000	ns
t_icf	I²C input fall time			300	ns
t_ocf	I²C output fall time	10-pF to 400-pF bus		300	ns
t_buf	I²C bus free time between STOP and START conditions		4.7		μs
t_sts	I²C START or repeated START condition setup		4.7		μs
t_sth	I²C START or repeated START condition hold		4		μs
t_sps	I²C STOP condition setup		4		μs
t_vd(data)	Valid-data time	SCL low to SDA output valid		1	μs
t_vd(ack)	Valid-data time of ACK condition	ACK signal from SCL low to SDA (out) low		1	μs
C_b	I²C bus capacitive load		0	400	pF
FAST MODE
f_scl	I²C clock frequency		0	400	kHz
t_sch	I²C clock high time		0.6		μs
t_scl	I²C clock low time		1.3		μs
t_sp	I²C spike time			50	ns
t_sds	I²C serial-data setup time		100		ns
t_sdh	I²C serial-data hold time		0		ns
t_icr	I²C input rise time		20	300	ns
t_icf	I²C input fall time		20 × (V_CC / 5.5 V)	300	ns
t_ocf	I²C output fall time	10-pF to 400-pF bus	20 × (V_CC / 5.5 V)	300	ns
t_buf	I²C bus free time between STOP and START conditions		1.3		μs
t_sts	I²C START or repeated START condition setup		0.6		μs
t_sth	I²C START or repeated START condition hold		0.6		μs
t_sps	I²C STOP condition setup		0.6		μs
t_vd(data)	Valid-data time	SCL low to SDA output valid		1	μs
t_vd(ack)	Valid-data time of ACK condition	ACK signal from SCL low to SDA (out) low		1	μs
C_b	I²C bus capacitive load		0	400	pF

6.7 Oscillator Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted)

		MIN	MAX	UNIT
STANDARD and FAST MODE
t_OSC	Oscillator start-up time from power-down or shutdown mode to fully on at 32 kHz	5		ms

6.8 Switching Characteristics

over recommended operating free-air temperature range, C_L ≤ 100 pF (unless otherwise noted)

PARAMETER		FROM (INPUT)	TO (OUTPUT)	MIN	MAX	UNIT
STANDARD and FAST MODE
t_pv	Output data valid (in general-purpose output mode)	SCL	P port		400	ns
t_ps	Shutdown data valid	EN (low)	P port (high)		70	μs
t_w	EN pulse duration			60		μs