ZHCSPO6E December 1982 – July 2022 SN74HC563
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC | DW (SOIC) | N (PDIP) | UNIT | |
|---|---|---|---|---|
| 20 PINS | 20 PINS | |||
| RθJA | Junction-to-ambient thermal resistance(1) | 109.1 | 84.6 | °C/W |
| RθJC (top) | Junction-to-case (top) thermal resistance | 76 | 72.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 77.6 | 65.3 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 51.5 | 55.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 77.1 | 65.2 | °C/W |
| RθJC (bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |