ZHCS603D November 2011 – April 2022 SN65HVDA100-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | SN65HVDA100-Q1 | UNIT | |
|---|---|---|---|
| D (SOIC) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 112.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 66.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 52.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 19.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 52.4 | °C/W |