ZHCSLK2 September 2020 SN55LVCP22
PRODUCTION DATA
| THERMAL METRIC(1) | SN55LVCP22A-SP | UNIT | |
|---|---|---|---|
| W (CFP) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 118.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 51.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 107.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 28.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 95.1 | °C/W |