SBVS299A April 2017 – September 2025 REF31-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | REF31xx-Q1 | UNIT | |
|---|---|---|---|
| DBZ (SOT-23) | |||
| 3 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 292.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 124.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 89 | °C/W |
| ψJT | Junction-to-top characterization parameter | 11.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 87.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |