ZHCSQ26 May   2022 PCM1822

PRODUCTION DATA  

1. 1 特性
2. 2 應用
3. 3 說明
4. 4 Revision History
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 Thermal Information
   5. 7.5 Electrical Characteristics
   6. 7.6 Timing Requirements:?TDM or I2S Interface
   7. 7.7 Switching Characteristics: TDM or I2S Interface
   8. 7.8 Typical Characteristics
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1 Hardware Control
      2. 8.3.2 Audio Serial Interfaces
         1. 8.3.2.1 Time Division Multiplexed Audio (TDM) Interface
         2. 8.3.2.2 Inter IC Sound (I2S) Interface
      3. 8.3.3 Phase-Locked Loop (PLL) and Clock Generation
      4. 8.3.4 Input Channel Configurations
      5. 8.3.5 Reference Voltage
      6. 8.3.6 Signal-Chain Processing
         1. 8.3.6.1 Digital High-Pass Filter
         2. 8.3.6.2 Configurable Digital Decimation Filters
            1. 8.3.6.2.1 Linear Phase Filters
               1. 8.3.6.2.1.1 Sampling Rate: 8 kHz or 7.35 kHz
               2. 8.3.6.2.1.2 Sampling Rate: 16 kHz or 14.7 kHz
               3. 8.3.6.2.1.3 Sampling Rate: 24 kHz or 22.05 kHz
               4. 8.3.6.2.1.4 Sampling Rate: 32 kHz or 29.4 kHz
               5. 8.3.6.2.1.5 Sampling Rate: 48 kHz or 44.1 kHz
               6. 8.3.6.2.1.6 Sampling Rate: 96 kHz or 88.2 kHz
               7. 8.3.6.2.1.7 Sampling Rate: 192 kHz or 176.4 kHz
            2. 8.3.6.2.2 Low-Latency Filters
               1. 8.3.6.2.2.1 Sampling Rate: 16 kHz or 14.7 kHz
               2. 8.3.6.2.2.2 Sampling Rate: 24 kHz or 22.05 kHz
               3. 8.3.6.2.2.3 Sampling Rate: 32 kHz or 29.4 kHz
               4. 8.3.6.2.2.4 Sampling Rate: 48 kHz or 44.1 kHz
               5. 8.3.6.2.2.5 Sampling Rate: 96 kHz or 88.2 kHz
      7. 8.3.7 Dynamic Range Enhancer (DRE)
   4. 8.4 Device Functional Modes
      1. 8.4.1 Active Mode
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
10. 10Power Supply Recommendations
11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
12. 12Device and Documentation Support
    1. 12.1 接收文檔更新通知
    2. 12.2 支持資源
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 術語表
13. 13Mechanical, Packaging, and Orderable Information