ZHCSID1B June 2018 – April 2021 LSF0204-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | LSF0204-Q1 | UNIT | |
|---|---|---|---|
| PW (TSSOP) | |||
| 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 157.9 | °C |
| RθJC(top) | Junction-to-case (top) thermal resistance | 82.3 | °C |
| RθJB | Junction-to-board thermal resistance | 100.0 | °C |
| ψJT | Junction-to-top characterization parameter | 22.9 | °C |
| ψJB | Junction-to-board characterization parameter | 99.0 | °C |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C |