SNVSB83B June 2019 – January 2020 LP8867-Q1 , LP8869-Q1
PRODUCTION DATA.
| THERMAL METRIC(1) | LP886x-Q1 | UNIT | |
|---|---|---|---|
| PWP (HTSSOP) | |||
| 20 PINS | |||
| RθJA | Junction-to-ambient thermal resistance(2) | 44.2 | °C/W |
| RθJCtop | Junction-to-case (top) thermal resistance | 26.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 22.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 22.2 | °C/W |
| RθJCbot | Junction-to-case (bottom) thermal resistance | 2.5 | °C/W |