ZHCSSH5A August 2023 – December 2024 LOG200
PRODMIX
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC (1) | LOG200 | UNIT | |
|---|---|---|---|
| RGT (VQFN) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 66.7 | ℃/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 61.8 | ℃/W |
| RθJB | Junction-to-board thermal resistance | 39.8 | ℃/W |
| ψJT | Junction-to-top characterization parameter | 3.8 | ℃/W |
| ψJB | Junction-to-board characterization parameter | 39.8 | ℃/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 31.2 | ℃/W |