ZHCSIC4C June   2018  – November 2018 LMX2615-SP

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
   1.     Device Images
      1.      簡(jiǎn)化原理圖
4. 4 修訂歷史記錄
5. 5 Pin Configuration and Functions
   1.     Pin Functions
      1.      CQFP Package (QFN) Pin Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Electrical Characteristics
   6. 6.6 Timing Requirements
   7. 6.7 Typical Characteristics
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1  Reference Oscillator Input
      2. 7.3.2  Reference Path
         1. 7.3.2.1 OSCin Doubler (OSC_2X)
         2. 7.3.2.2 Pre-R Divider (PLL_R_PRE)
         3. 7.3.2.3 Post-R Divider (PLL_R)
      3. 7.3.3  State Machine Clock
      4. 7.3.4  PLL Phase Detector and Charge Pump
      5. 7.3.5  N Divider and Fractional Circuitry
      6. 7.3.6  MUXout Pin
         1. 7.3.6.1 Serial data output for readback
         2. 7.3.6.2 Lock detect indicator set as type “VCOCal”
         3. 7.3.6.3 Lock detect indicator set as type “Vtune and VCOCal”
      7. 7.3.7  VCO (Voltage Controlled Oscillator)
         1. 7.3.7.1 VCO Calibration
         2. 7.3.7.2 Watchdog Feature
         3. 7.3.7.3 RECAL Feature
         4. 7.3.7.4 Determining the VCO Gain
      8. 7.3.8  Channel Divider
      9. 7.3.9  Output Buffer
      10. 7.3.10 Powerdown Modes
      11. 7.3.11 Treatment of Unused Pins
      12. 7.3.12 Phase Synchronization
          1. 7.3.12.1 General Concept
          2. 7.3.12.2 Categories of Applications for SYNC
          3. 7.3.12.3 Procedure for Using SYNC
          4. 7.3.12.4 SYNC Input Pin
      13. 7.3.13 Phase Adjust
      14. 7.3.14 Fine Adjustments for Phase Adjust and Phase SYNC
      15. 7.3.15 SYSREF
          1. 7.3.15.1 Programmable Fields
          2. 7.3.15.2 Input and Output Pin Formats
             1. 7.3.15.2.1 SYSREF Output Format
          3. 7.3.15.3 Examples
          4. 7.3.15.4 SYSREF Procedure
      16. 7.3.16 Pin Modes
   4. 7.4 Device Functional Modes
   5. 7.5 Programming
      1. 7.5.1 Recommended Initial Power-Up Sequence
      2. 7.5.2 Recommended Sequence for Changing Frequencies
   6. 7.6 Register Maps
      1. 7.6.1 Register Map
         1. 7.6.1.1  R0 Register (Address = 0x0) [reset = X]
            1. Table 22. R0 Register Field Descriptions
         2. 7.6.1.2  R1 Register (Address = 0x1) [reset = 0x4]
            1. Table 23. R1 Register Field Descriptions
         3. 7.6.1.3  R8 Register (Address = 0x8) [reset = X]
            1. Table 24. R8 Register Field Descriptions
         4. 7.6.1.4  R9 Register (Address = 0x9) [reset = X]
            1. Table 25. R9 Register Field Descriptions
         5. 7.6.1.5  R11 Register (Address = 0xB) [reset = 0x10]
            1. Table 26. R11 Register Field Descriptions
         6. 7.6.1.6  R12 Register (Address = 0xC) [reset = 0x1]
            1. Table 27. R12 Register Field Descriptions
         7. 7.6.1.7  R14 Register (Address = 0xE) [reset = 0x70]
            1. Table 28. R14 Register Field Descriptions
         8. 7.6.1.8  R16 Register (Address = 0x10) [reset = 0x80]
            1. Table 29. R16 Register Field Descriptions
         9. 7.6.1.9  R19 Register (Address = 0x13) [reset = 0xB7]
            1. Table 30. R19 Register Field Descriptions
         10. 7.6.1.10 R20 Register (Address = 0x14) [reset = X]
             1. Table 31. R20 Register Field Descriptions
         11. 7.6.1.11 R31 Register (Address = 0x1F) [reset = X]
             1. Table 32. R31 Register Field Descriptions
         12. 7.6.1.12 R34 Register (Address = 0x22) [reset = 0x0]
             1. Table 33. R34 Register Field Descriptions
         13. 7.6.1.13 R36 Register (Address = 0x24) [reset = 0x46]
             1. Table 34. R36 Register Field Descriptions
         14. 7.6.1.14 R37 Register (Address = 0x25) [reset = 0x400]
             1. Table 35. R37 Register Field Descriptions
         15. 7.6.1.15 R38 Register (Address = 0x26) [reset = 0xFD51]
             1. Table 36. R38 Register Field Descriptions
         16. 7.6.1.16 R39 Register (Address = 0x27) [reset = 0xDA80]
             1. Table 37. R39 Register Field Descriptions
         17. 7.6.1.17 R40 Register (Address = 0x28) [reset = 0x0]
             1. Table 38. R40 Register Field Descriptions
         18. 7.6.1.18 R41 Register (Address = 0x29) [reset = 0x0]
             1. Table 39. R41 Register Field Descriptions
         19. 7.6.1.19 R42 Register (Address = 0x2A) [reset = 0x0]
             1. Table 40. R42 Register Field Descriptions
         20. 7.6.1.20 R43 Register (Address = 0x2B) [reset = 0x0]
             1. Table 41. R43 Register Field Descriptions
         21. 7.6.1.21 R44 Register (Address = 0x2C) [reset = 0x1FA3]
             1. Table 42. R44 Register Field Descriptions
         22. 7.6.1.22 R45 Register (Address = 0x2D) [reset = X]
             1. Table 43. R45 Register Field Descriptions
         23. 7.6.1.23 R46 Register (Address = 0x2E) [reset = 0x1]
             1. Table 44. R46 Register Field Descriptions
         24. 7.6.1.24 R58 Register (Address = 0x3A) [reset = X]
             1. Table 45. R58 Register Field Descriptions
         25. 7.6.1.25 R59 Register (Address = 0x3B) [reset = 0x1]
             1. Table 46. R59 Register Field Descriptions
         26. 7.6.1.26 R60 Register (Address = 0x3C) [reset = 0x9C4]
             1. Table 47. R60 Register Field Descriptions
         27. 7.6.1.27 R69 Register (Address = 0x45) [reset = 0x0]
             1. Table 48. R69 Register Field Descriptions
         28. 7.6.1.28 R70 Register (Address = 0x46) [reset = 0xC350]
             1. Table 49. R70 Register Field Descriptions
         29. 7.6.1.29 R71 Register (Address = 0x47) [reset = 0x80]
             1. Table 50. R71 Register Field Descriptions
         30. 7.6.1.30 R72 Register (Address = 0x48) [reset = 0x1]
             1. Table 51. R72 Register Field Descriptions
         31. 7.6.1.31 R73 Register (Address = 0x49) [reset = 0x3F]
             1. Table 52. R73 Register Field Descriptions
         32. 7.6.1.32 R74 Register (Address = 0x4A) [reset = 0x0]
             1. Table 53. R74 Register Field Descriptions
         33. 7.6.1.33 R75 Register (Address = 0x4B) [reset = 0x0]
             1. Table 54. R75 Register Field Descriptions
         34. 7.6.1.34 R110 Register (Address = 0x6E) [reset = 0x0]
             1. Table 55. R110 Register Field Descriptions
         35. 7.6.1.35 R111 Register (Address = 0x6F) [reset = 0x0]
             1. Table 56. R111 Register Field Descriptions
         36. 7.6.1.36 R112 Register (Address = 0x70) [reset = 0x0]
             1. Table 57. R112 Register Field Descriptions
         37. 7.6.1.37 R113 Register (Address = 0x71) [reset = 0x0]
             1. Table 58. R113 Register Field Descriptions
         38. 7.6.1.38 R114 Register (Address = 0x72) [reset = 0x26F]
             1. Table 59. R114 Register Field Descriptions
8. 8 Application and Implementation
   1. 8.1 Application Information
      1. 8.1.1 OSCin Configuration
      2. 8.1.2 OSCin Slew Rate
      3. 8.1.3 RF Output Buffer Power Control
      4. 8.1.4 RF Output Buffer Pullup
         1. 8.1.4.1 Resistor Pullup
         2. 8.1.4.2 Inductor Pullup
         3. 8.1.4.3 Combination Pullup
      5. 8.1.5 RF Output Treatment for the Complimentary Side
         1. 8.1.5.1 Single-Ended Termination of Unused Output
         2. 8.1.5.2 Differential Termination
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
9. 9 Power Supply Recommendations
10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Footprint Example on PCB Layout
    4. 10.4 Radiation Environments
       1. 10.4.1 Total Ionizing Dose
       2. 10.4.2 Single Event Effect
11. 11器件和文檔支持
    1. 11.1 器件支持
       1. 11.1.1 第三方產(chǎn)品免責(zé)聲明
       2. 11.1.2 開(kāi)發(fā)支持
    2. 11.2 文檔支持
       1. 11.2.1 相關(guān)文檔
    3. 11.3 商標(biāo)
    4. 11.4 靜電放電警告
    5. 11.5 術(shù)語(yǔ)表
12. 12機(jī)械、封裝和可訂購(gòu)信息
    1. 12.1 工程樣片
    2. 12.2 封裝機(jī)械信息