ZHCSIC4C June 2018 – November 2018 LMX2615-SP
PRODUCTION DATA.
| THERMAL METRIC(1) | CQFP | UNIT | |
|---|---|---|---|
| 64 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 22.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance (2) | 7.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 7.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 2.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 7.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.0 | °C/W |