ZHCSFR2B December 2016 – March 2018 LMR23630-Q1
PRODUCTION DATA.
| THERMAL METRIC(1)(2) | LMR23630-Q1 | UNIT | ||
|---|---|---|---|---|
| DDA (SOIC) | DRR (WSON) | |||
| 8 PINS | 12 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 42.0 | 41.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 5.9 | 0.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 23.4 | 16.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 45.8 | 39.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 3.6 | 3.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 23.4 | 16.3 | °C/W |