ZHCSLT3B december 2020 – june 2023 LMK1D1204 , LMK1D1208
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Revision History
- 5 Device Comparison
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Parameter Measurement Information
- 9 Detailed Description
- 10Application and Implementation
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RGT|16
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RGT|16
訂購(gòu)信息
8 Parameter Measurement Information
Figure 8-1 LVDS Output DC Configuration During Device Test
Figure 8-2 LVDS
Output AC Configuration During Device Test
Figure 8-3 DC-Coupled LVCMOS Input During Device Test
Figure 8-4 Output Voltage and Rise/Fall Time
A. Output skew is calculated as the greater of the following: the difference between the fastest and the slowest tPLHn or the difference between the fastest and the slowest tPHLn (n = 0, 1, 2, ..7)
B. Part to part skew is calculated as the greater of the following: the difference between the fastest and the slowest tPLHn or the difference between the fastest and the slowest tPHLn across multiple devices (n = 0, 1, 2, ..7)
Figure 8-5 Output Skew and Part-to-Part Skew
Figure 8-6 Output Overshoot and Undershoot
Figure 8-7 Output AC Common Mode