ZHCSKK6D December 2019 – February 2022 LMK1C1102 , LMK1C1103 , LMK1C1104
PRODUCTION DATA
| THERMAL METRIC(1) | LMK1C1104 | UNIT | ||
|---|---|---|---|---|
| DQF(WSON) | PW (TSSOP) | |||
| 8 PINS | 8 PINS | |||
| RqJA | Junction-to-ambient thermal resistance | 163 | 181.9 | °C/W |
| RqJC(top) | Junction-to-case (top) thermal resistance | 105.7 | 76.6 | °C/W |
| RqJB | Junction-to-board thermal resistance | 84.2 | 111.6 | °C/W |
| YJT | Junction-to-top characterization parameter | 16.7 | 16 | °C/W |
| YJB | Junction-to-board characterization parameter | 83.9 | 110.1 | °C/W |