ZHCSCZ6C December 2013 – July 2021 LMK00338
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RTA|40
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RTA|40
訂購(gòu)信息
6.6 Typical Characteristics
Unless otherwise specified: VCC = 3.3 V, VCCO = 3.3 V, TA = 25°C, CLKin driven differentially, input slew rate ≥ 3 V/ns.
Figure 6-1 HCSL Output Swing at 250 MHz
| Fclk = 100 MHz | Foffset = 20 MHz | |
| Fclk = 100 MHz | Int. BW = 1 to 20 MHz | |
| Fclk = 156.25 MHz | VCCO Ripple = 100 | |
Figure 6-9 Propagation Delay vs Temperature
Figure 6-11 HCSL Phase Noise at 100 MHz
Figure 6-2 LVCMOS Output Swing at 250 MHz
| Fclk = 156.25 MHz | Foffset = 20 MHz | |
| Fclk = 156.25 MHz | Int. BW = 1 to 20 MHz | |
| Fclk = 312.5 MHz | VCCO Ripple = 100 mVpp | |
Figure 6-10 Crystal Power Dissipation vs RLIM