ZHCSO08A December 2021 – November 2022 LMH5485-SEP
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | LMH5485-SEP | UNIT | |
|---|---|---|---|
| DGK (VSSOP) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 171.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 63.4 | |
| RθJB | Junction-to-board thermal resistance | 93.4 | |
| ψJT | Junction-to-top characterization parameter | 9.2 | |
| ψJB | Junction-to-board characterization parameter | 91.9 | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | |