ZHCSKX9D May   2019  – July 2022 LM61460

PRODUCTION DATA  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
4. 4 Revision History
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2.     ESD Ratings
   3. 7.2 Recommended Operating Conditions
   4. 7.3 Thermal Information
   5. 7.4 Electrical Characteristics
   6. 7.5 Timing Characteristics
   7. 7.6 Systems Characteristics
   8. 7.7 Typical Characteristics
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1  EN/SYNC Uses for Enable and VIN UVLO
      2. 8.3.2  EN/SYNC Pin Uses for Synchronization
      3. 8.3.3  Clock Locking
      4. 8.3.4  Adjustable Switching Frequency
      5. 8.3.5  PGOOD Output Operation
      6. 8.3.6  Internal LDO, VCC UVLO, and BIAS Input
      7. 8.3.7  Bootstrap Voltage and VCBOOT-UVLO (CBOOT Pin)
      8. 8.3.8  Adjustable SW Node Slew Rate
      9. 8.3.9  Spread Spectrum
      10. 8.3.10 Soft Start and Recovery From Dropout
      11. 8.3.11 Output Voltage Setting
      12. 8.3.12 Overcurrent and Short Circuit Protection
      13. 8.3.13 Thermal Shutdown
      14. 8.3.14 Input Supply Current
   4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
         1. 8.4.3.1 CCM Mode
         2. 8.4.3.2 Auto Mode – Light-Load Operation
            1. 8.4.3.2.1 Diode Emulation
            2. 8.4.3.2.2 Frequency Reduction
         3. 8.4.3.3 FPWM Mode – Light-Load Operation
         4. 8.4.3.4 Minimum On-Time (High Input Voltage) Operation
         5. 8.4.3.5 Dropout
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
         1. 9.2.2.1  Choosing the Switching Frequency
         2. 9.2.2.2  Setting the Output Voltage
         3. 9.2.2.3  Inductor Selection
         4. 9.2.2.4  Output Capacitor Selection
         5. 9.2.2.5  Input Capacitor Selection
         6. 9.2.2.6  BOOT Capacitor
         7. 9.2.2.7  BOOT Resistor
         8. 9.2.2.8  VCC
         9. 9.2.2.9  BIAS
         10. 9.2.2.10 CFF and RFF Selection
         11. 9.2.2.11 External UVLO
      3. 9.2.3 Application Curves
      4. 9.2.4 USB Type-C System Example
         1. 9.2.4.1 Design Requirements
         2. 9.2.4.2 Detailed Design Procedure
         3. 9.2.4.3 Application Curves
10. 10Power Supply Recommendations
11. 11Layout
    1. 11.1 Layout Guidelines
       1. 11.1.1 Ground and Thermal Considerations
    2. 11.2 Layout Example
12. 12Device and Documentation Support
    1. 12.1 Documentation Support
       1. 12.1.1 Related Documentation
    2. 12.2 接收文檔更新通知
    3. 12.3 支持資源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 術(shù)語(yǔ)表
13. 13Mechanical, Packaging, and Orderable Information