ZHCSKX9D May 2019 – July 2022 LM61460
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 EN/SYNC Uses for Enable and VIN UVLO
- 8.3.2 EN/SYNC Pin Uses for Synchronization
- 8.3.3 Clock Locking
- 8.3.4 Adjustable Switching Frequency
- 8.3.5 PGOOD Output Operation
- 8.3.6 Internal LDO, VCC UVLO, and BIAS Input
- 8.3.7 Bootstrap Voltage and VCBOOT-UVLO (CBOOT Pin)
- 8.3.8 Adjustable SW Node Slew Rate
- 8.3.9 Spread Spectrum
- 8.3.10 Soft Start and Recovery From Dropout
- 8.3.11 Output Voltage Setting
- 8.3.12 Overcurrent and Short Circuit Protection
- 8.3.13 Thermal Shutdown
- 8.3.14 Input Supply Current
- 8.4 Device Functional Modes
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
- RJR|14
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
12.5 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |