ZHCS573I August 2010 – April 2018 LM25119
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 High Voltage Start-Up Regulator
- 7.3.2 UVLO
- 7.3.3 Enable 2
- 7.3.4 Oscillator and Sync Capability
- 7.3.5 Error Amplifiers and PWM Comparators
- 7.3.6 Ramp Generator
- 7.3.7 Current Limit
- 7.3.8 Hiccup Mode Current Limiting
- 7.3.9 Soft Start
- 7.3.10 HO and LO Output Drivers
- 7.3.11 Maximum Duty Cycle
- 7.3.12 Thermal Protection
- 7.4 Device Functional Modes
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Applications
- 8.2.1
Dual-output Design Example
- 8.2.1.1 Design Requirements
- 8.2.1.2
Detailed Design Procedure
- 8.2.1.2.1 Timing Resistor
- 8.2.1.2.2 Output Inductor
- 8.2.1.2.3 Current Sense Resistor
- 8.2.1.2.4 Ramp Resistor and Ramp Capacitor
- 8.2.1.2.5 Output Capacitors
- 8.2.1.2.6 Input Capacitors
- 8.2.1.2.7 VCC Capacitor
- 8.2.1.2.8 Bootstrap Capacitor
- 8.2.1.2.9 Soft Start Capacitor
- 8.2.1.2.10 Restart Capacitor
- 8.2.1.2.11 Output Voltage Divider
- 8.2.1.2.12 UVLO Divider
- 8.2.1.2.13 MOSFET Selection
- 8.2.1.2.14 MOSFET Snubber
- 8.2.1.2.15 Error Amplifier Compensation
- 8.2.1.3 Application Curves
- 8.2.2 Two-Phase Design Example
- 8.2.1
Dual-output Design Example
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購(gòu)信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RTV|32
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RTV|32
訂購(gòu)信息
6.7 Typical Characteristics
Figure 1. HO Peak Driver Current vs Output Voltage
Figure 3. Driver Dead Time vs VCC
Figure 5. VCC vs IVCC
Figure 7. Error Amp Gain and Phase vs Frequency
Figure 2. LO Peak Driver Current vs Output Voltage
Figure 4. Driver Dead Time vs Temperature
Figure 6. Switching Frequency vs RT