ZHCSPK0 July   2022 ISOW7721

PRODUCTION DATA  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
4. 4 Revision History
5. 5 說(shuō)明（續(xù)）
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Recommended Operating Conditions
   4. 7.4  Thermal Information
   5. 7.5  Power Ratings
   6. 7.6  Insulation Specifications
   7. 7.7  Safety-Related Certifications
   8. 7.8  Safety Limiting Values
   9. 7.9  Electrical Characteristics - Power Converter
   10. 7.10 Supply Current Characteristics - Power Converter
   11. 7.11 Electrical Characteristics Channel Isolator - VIO, VISOIN = 5-V
   12. 7.12 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 5-V
   13. 7.13 Electrical Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
   14. 7.14 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
   15. 7.15 Electrical Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
   16. 7.16 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
   17. 7.17 Electrical Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
   18. 7.18 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
   19. 7.19 Switching Characteristics - 5-V Supply
   20. 7.20 Switching Characteristics - 3.3-V Supply
   21. 7.21 Switching Characteristics - 2.5-V Supply
   22. 7.22 Switching Characteristics - 1.8-V Supply
   23. 7.23 Insulation Characteristics Curves
   24. 7.24 Typical Characteristics
8. 8 Parameter Measurement Information
9. 9 Detailed Description
   1. 9.1 Overview
      1. 9.1.1 Power Isolation
      2. 9.1.2 Signal Isolation
   2. 9.2 Functional Block Diagram
   3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 9.3.2 Power-Up and Power-Down Behavior
      3. 9.3.3 Protection Features
      4. 9.3.4 Multi-Device Chaining for Increased Power Output
   4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
       1. 10.2.1 Design Requirements
       2. 10.2.2 Detailed Design Procedure
       3. 10.2.3 Application Curve
       4. 10.2.4 Insulation Lifetime
11. 11Power Supply Recommendations
12. 12Layout
    1. 12.1 Layout Guidelines
       1. 12.1.1 PCB Material
    2. 12.2 Layout Example
13. 13Device and Documentation Support
    1. 13.1 Device Support
       1. 13.1.1 Development Support
    2. 13.2 Documentation Support
       1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 支持資源
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 術(shù)語(yǔ)表
14. 14Mechanical, Packaging, and Orderable Information