ZHCSX85M September 2007 – February 2025 ISO7230C , ISO7231C , ISO7231M
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | ISO7230C, ISO7231C, ISO7231M |
UNIT | ||
|---|---|---|---|---|
| DW (SOIC) | ||||
| 16 PINS | ||||
| RθJA | Junction-to-ambient thermal resistance | 168 | °C/W | |
| 68.6 | °C/W | |||
| RθJC(top) | Junction-to-case (top) thermal resistance | 33.9 | °C/W | |
| RθJB | Junction-to-board thermal resistance | 33.5 | °C/W | |
| ψJT | Junction-to-top characterization parameter | 14.8 | °C/W | |
| ψJB | Junction-to-board characterization parameter | 32.9 | °C/W | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W | |