ZHCSHF6N January 2006 – February 2025 ISO721 , ISO721M , ISO722 , ISO722M
PRODUCTION DATA
| THERMAL METRIC(1) | ISO72x | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) | |||||
| 8 PINS | |||||
| RθJA | Junction-to-ambient thermal resistance | High-K Board | 114.7 | °C/W | |
| Low-K Board | 263 | ||||
| RθJC(top) | Junction-to-case (top) thermal resistance | 63 | °C/W | ||
| RθJB | Junction-to-board thermal resistance | 54.8 | °C/W | ||
| ψJT | Junction-to-top characterization parameter | 18.9 | °C/W | ||
| ψJB | Junction-to-board characterization parameter | 54.3 | °C/W | ||
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W | ||