ZHCS029E January 2011 – August 2023 ISO3086T
PRODUCTION DATA
| THERMAL METRIC(1) | ISO308x | UNIT | |
|---|---|---|---|
| DW (SOIC) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 80.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 43.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 49.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 13.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 41.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |